Name:
IEC/PAS 61191-10 Ed. 1.0 en:2022 PDF
Published Date:
07/01/2022
Status:
Active
Publisher:
International Electrotechnical Commission - Publicly Available Standard
Due to the continuous miniaturization of printed circuit boards in recent years, live components and conductors are moving ever closer together, increasing the risk of leakage current formation under moisture. Due to the good dielectric properties of protective coatings, minimum distances between live conductors can be reduced.
| File Size : | 1 file , 6.1 MB |
| ISBN(s) : | 9782832239810 |
| Note : | This product is unavailable in Canada |
| Number of Pages : | 214 |
| Published : | 07/01/2022 |
